Intel and Odisha government to establish a $3.3 billion semiconductor materials plant in India.

Intel, 3D Glass Solutions (3DGS), and the Government of Odisha have entered into a memorandum of understanding (MoU) to set up a substrate manufacturing technology facility in India, featuring an estimated investment of $3.3 billion.

The initiative, which will be rolled out in stages over the coming five to six years, is expected to create approximately 1,800 skilled positions. The facility will concentrate on substrate manufacturing, an essential material and process utilized for mounting semiconductor chips on motherboards.

Union Minister Ashwini Vaishnaw expressed his support for the announcement on X, congratulating the Odisha government, Intel, and 3DGS for finalizing the agreement. “This will significantly advance the semiconductor ecosystem in India,” Vaishnaw stated.

Congrats to the Govt. of Odisha, Intel, and 3DGS for signing an MoU to introduce substrate manufacturing technology in India.

This will significantly advance the semiconductor ecosystem in India. pic.twitter.com/elxs6r8muN

— Ashwini Vaishnaw (@AshwiniVaishnaw) May 29, 2026

This development represents a crucial milestone in India’s initiatives to bolster its semiconductor ecosystem and enhance domestic chip manufacturing capabilities.