At Davos, Chodankar emphasized that the Indian government was instrumental in RRP Group’s entry into the semiconductor industry, particularly through policy support and financial incentives. “The government played a crucial role in motivating us to establish this facility,” he noted, adding that an appealing subsidy provided the confidence to invest in high-cost machinery and infrastructure. RRP Group launched its semiconductor facility in Maharashtra in September 2024 after approximately 14 months of development.
Chodankar mentioned that the company’s foray into semiconductors received an unexpected boost from cricket icon Sachin Tendulkar joining as a strategic investor. Tendulkar was already affiliated with RRP Group when discussions about semiconductors commenced. Reflecting on their collaboration, Chodankar stated that Tendulkar quickly understood the significance of this technology, highlighting that even household appliances now rely on chips. “As time progresses, it’s increasingly becoming a necessity rather than a luxury,” Chodankar remarked.
He described Tendulkar’s involvement as a source of inspiration and credibility, especially during challenging phases of the project. According to Chodankar, the support from the former cricketer has invigorated the team and reinforced the long-term vision of developing domestic semiconductor capabilities.
Looking forward, RRP Group is planning substantial expansion efforts. The company has secured approximately 100 acres of land in Panvel, near Mumbai, earmarked for a proposed semiconductor fab, with an investment of around ₹12,000 crore. This land acquisition includes a 50% subsidy, enhancing the project’s financial feasibility. Chodankar revealed plans to establish several outsourced semiconductor assembly and test (OSAT) lines, along with a prototype fab focused on compound semiconductor chips.
The company initially aims to concentrate on legacy packaging for automotive applications while also gearing up to serve other sectors such as electronics, memory chips, and SIM cards. Overall, RRP Group anticipates setting up five to seven OSAT lines over time. Chodankar shared the objective of launching its first prototype chip by the end of the next quarter.
The initial prototype will target thermal imaging applications, an area where RRP Group already possesses robust expertise. Chodankar noted that teams from the semiconductor ecosystem have reacted positively to the progress achieved thus far. He emphasized that the government’s aim extends beyond merely manufacturing chips. “The Indian government’s actual goal is not just to produce a chip, but to advance towards forward integration,” he stated.
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As part of this strategy, RRP Group intends to integrate its prototype chip into a complete thermal imaging camera system, which can then be provided to government agencies and customers for assessment. Following technology validation, the company will proceed to pilot production, ultimately leading to full-scale manufacturing.
Chodankar believes RRP Group will have a functional production line for thermal imaging chips by the end of 2027, marking a significant milestone in India’s efforts to establish a domestic semiconductor ecosystem under the Make in India and semiconductor mission initiatives.
Below is the verbatim transcript of the interview.
Q: You are part of the government’s semiconductor mission. Let’s start by talking about how you got started.
Chodankar: I believe the government played a vital role in encouraging us to launch this facility. Initially, they approved our project with a very attractive subsidy, which instilled confidence in us to proceed with investments—investing in machinery and setup, since it is a costly venture. Thanks to the government, we received continuous support from day one. After 14 months of dedicated effort, we successfully commissioned this facility in September 2024.
Q: While you inaugurated the facility in September 2024, you’ve also brought on the legendary Sachin Tendulkar as an investor. How did that occur?
Chodankar: That has been one of the best developments in our semiconductor journey. Sachin Tendulkar was already connected with us through the RRP Group, and during a discussion, I mentioned that we were venturing into semiconductors. On the foundation day, he demonstrated awareness of this technology, being the first to point out that even a washing machine contains a chip. As time passes, it’s becoming an essential rather than a luxury. Truly, he’s been a blessing for us—beneficial to the state and nation alike. He continually motivates us, especially during difficult periods. His presence elevates our efforts. We owe our current position to his support and commitment as a strategic investor in this project.
Q: Let’s discuss your future plans regarding the fab. You’ve acquired around 100 acres of land with an investment of approximately ₹12,000 crore proposed for the fab facility. Can you elaborate on those details?
Chodankar: To accomplish anything, land is essential, and the government graciously offered us 100 acres in Panvel, which also includes a 50% subsidy. Our project plan encompasses the construction of multiple OSAT lines and a prototype fab for developing compound semiconductor chips. By “multiple OSAT lines,” I mean that semiconductors encompass various disciplines. Currently, we’re focusing on legacy packaging for automotive applications, alongside segments like electronics, memory chips, and SIM cards. In total, we plan for at least five to seven lines. We anticipate having our first prototype chip by the end of the next quarter, aimed at thermal imaging applications, an area where RRP Group has core competencies.
Q: So, you’re suggesting that the prototype may be ready as soon as next quarter?
Chodankar: Yes, we expect our first prototype chip by the end of next quarter, specifically for thermal imaging applications. It’s encouraging that visitors from the semiconductor community have positively acknowledged our progress. Ultimately, the Indian government aims not only to produce chips but also to pursue forward integration. Once we have this prototype chip, we plan to incorporate it into our thermal imaging system. We will then create a complete camera system, which will be offered to government agencies or customers for evaluation. Once we’re successful in this phase, we’ll transition into pilot production and subsequently full production. By the end of 2027, we aim to establish a functional line for producing chips focused on thermal imaging.
